Product Name:K-858
Kaisi 858 mobile repairing gun SMD hot air gun soldering rework station for BGA soldering
Product Details
Product Norm
Aftermarket Service
· For Soldering and desoldering SMD.
· Soft and rotating hot air will not damage the component.
· Suitable for most of SMD,such as SOIC,CHIP,QFP,PLCC,BGA,etc.
· Professional and precision phone repair tool.
· Professional soldering rework station for phone repairing.
· Soft and rotating hot air will not damage the component.
· Suitable for most of SMD,such as SOIC,CHIP,QFP,PLCC,BGA,etc.
· Professional and precision phone repair tool.
· Professional soldering rework station for phone repairing.
POWER: 700W
INPUT：AC 220V 50Hz
TEMPERATURE:100℃~450℃
FUSE：4A
SIZE：150*100*138mm
N.W.：1.60KG
INPUT：AC 220V 50Hz
TEMPERATURE:100℃~450℃
FUSE：4A
SIZE：150*100*138mm
N.W.：1.60KG
Official Service